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TKID 13197190
Tendering Authority Department Of Electronics And Information Technology
Description : Expression of Interest -enabling Packaging, Multi-project Wafer (mpw) Prototyping And Post Silicon Validation Services For Chipin Centre
Location Bangalore, Karnataka, India
Estimated Cost INR 0.00
EMD INR 0.00
Doc Cost INR 0.00
Last Date for Submission 2024-11-04
Opening Date 2024-11-05
Tender Document Download Document

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