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TKID 13210870
Tendering Authority Society for Integrated Circuit Technology And Applied Research
Description : Gold Wire Bonding Services On Customized Metal Packages
Location Bangalore, Karnataka, India
Estimated Cost INR 1794000.00
EMD INR 0.00
Doc Cost INR 0.00
Last Date for Submission 2024-11-11
Opening Date 2024-11-12
Tender Document Download Document

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